? semiconductor components industries, llc, 2014 august, 2014 ? rev. 11 1 publication order number: mc14069ub/d mc14069ub hex inverter the mc14069ub hex inverter is constructed with mos p?channel and n?channel enhancement mode devices in a single monolithic structure. these inverters find primary use where low power dissipation and/or high noise immunity is desired. each of the six inverters is a single stage to minimize propagation delays. features ? supply voltage range = 3.0 vdc to 18 vdc ? capable of driving two low?power ttl loads or one low?power schottky ttl load over the rated temperature range ? triple diode protection on all inputs ? pin?for?pin replacement for cd4069ub ? meets jedec ub specifications ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free and are rohs compliant maximum ratings (voltages referenced to v ss ) symbol parameter value unit v dd dc supply voltage range ?0.5 to +18.0 v v in , v out input or output voltage range (dc or transient) ?0.5 to v dd + 0.5 v i in , i out input or output current (dc or transient) per pin 10 ma p d power dissipation, per package (note 1) 500 mw t a ambient temperature range ?55 to +125 c t stg storage temperature range ?65 to +150 c t l lead temperature (8?second soldering) 260 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. temperature derating: ?d/dw? packages: ?7.0 mw/ c from 65 c to 125 c this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high?impedance circuit. for proper operation, v in and v out should be constrained to the range v ss (v in or v out ) v dd . unused inputs must always be tied to an appropriate logic voltage level (e.g., either v ss or v dd ). unused outputs must be left open. marking diagrams soic?14 tssop?14 1 14 14069ug awlyww 14 069u alyw 1 14 a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g or = pb?free package soeiaj?14 1 14 mc14069ub alywg see detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ordering information http://onsemi.com (note: microdot may be in either location) soic?14 d suffix case 751a tssop?14 dt suffix case 948g soeiaj?14 f suffix case 965 11 12 13 14 8 9 10 5 4 3 2 1 7 6 out 5 in 5 out 6 in 6 v dd out 4 in 4 out 2 in 2 out 1 in 1 v ss out 3 in 3 pin assignment
mc14069ub http://onsemi.com 2 figure 1. logic diagram figure 2. circuit schematic 13 11 9 5 3 1 12 10 8 6 4 2 v dd = pin 14 v ss = pin 7 v dd v ss output input* *double diode protection on all inputs not shown figure 3. switching time test circuit and waveforms pulse generator v dd v ss 7 input output c l 14 20 ns 20 ns v dd v ss v oh v ol t thl t tlh output input t phl t plh 90% 50% 10% 90% 50% 10% (1/6 of circuit shown) ordering information device package shipping ? mc14069ubdg soic?14 (pb?free) 55 units / rail nlv14069ubdg* soic?14 (pb?free) 55 units / rail mc14069ubdr2g soic?14 (pb?free) 2500 units / tape & reel nlv14069ubdr2g* soic?14 (pb?free) 2500 units / tape & reel mc14069ubdtr2g tssop?14 (pb?free) 2500 units / tape & reel nlv14069ubdtr2g* tssop?14 (pb?free) 2500 units / tape & reel mc14069ubfelg soeiaj?14 (pb?free) 2000 units / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
mc14069ub http://onsemi.com 3 electrical characteristics (voltages referenced to v ss ) characteristic symbo l v dd vdc ?55 c 25 c 125 c unit min max min typ (note 2) max min max output voltage ?0? leve l v in = v dd v in = 0 ?1? leve l v ol 5.0 10 15 ? ? ? 0.05 0.05 0.05 ? ? ? 0 0 0 0.05 0.05 0.05 ? ? ? 0.05 0.05 0.05 vdc v oh 5.0 10 15 4.95 9.95 14.95 ? ? ? 4.95 9.95 14.95 5.0 10 15 ? ? ? 4.95 9.95 14.95 ? ? ? vdc input voltage ?0? leve l (v o = 4.5 vdc) (v o = 9.0 vdc) (v o = 13.5 vdc) ?1? leve l (v o = 0.5 vdc) (v o = 1.0 vdc) (v o = 1.5 vdc) v il 5.0 10 15 ? ? ? 1.0 2.0 2.5 ? ? ? 2.25 4.50 6.75 1.0 2.0 2.5 ? ? ? 1.0 2.0 2.5 vdc v ih 5.0 10 15 4.0 8.0 12.5 ? ? ? 4.0 8.0 12.5 2.75 5.50 8.25 ? ? ? 4.0 8.0 12.5 ? ? ? vdc output drive current (v oh = 2.5 vdc) source (v oh = 4.6 vdc) (v oh = 9.5 vdc) (v oh = 13.5 vdc) (v ol = 0.4 vdc) sin k (v ol = 0.5 vdc) (v ol = 1.5 vdc) i oh 5.0 5.0 10 15 ?3.0 ?0.64 ?1.6 ?4.2 ? ? ? ? ?2.4 ?0.51 ?1.3 ?3.4 ?4.2 ?0.88 ?2.25 ?8.8 ? ? ? ? ?1.7 ?0.36 ?0.9 ?2.4 ? ? ? ? madc i ol 5.0 10 15 0.64 1.6 4.2 ? ? ? 0.51 1.3 3.4 0.88 2.25 8.8 ? ? ? 0.36 0.9 2.4 ? ? ? madc input current i in 15 ? 0.1 ? 0.00001 0.1 ? 1.0 adc input capacitance (v in = 0) c in ? ? ? ? 5.0 7.5 ? ? pf quiescent current (per package) i dd 5.0 10 15 ? ? ? 0.25 0.5 1.0 ? ? ? 0.0005 0.0010 0.0015 0.25 0.5 1.0 ? ? ? 7.5 15 30 adc total supply current (notes 3 and 4) (dynamic plus quiescent, per gate) (c l = 50 pf) i t 5.0 10 15 i t = (0.3 a/khz) f + i dd /6 i t = (0.6 a/khz) f + i dd /6 i t = (0.9 a/khz) f + i dd /6 adc output rise and fall times (note 3) (c l = 50 pf) t tlh , t thl = (1.35 ns/pf) c l + 33 ns t tlh , t thl = (0.60 ns/pf) c l + 20 ns t tlh , t thl = (0.40 ns/pf) c l + 20 ns t tlh , t thl 5.0 10 15 ? ? ? ? ? ? ? ? ? 100 50 40 200 100 80 ? ? ? ? ? ? ns propagation delay times (note 3) (c l = 50 pf) t plh , t phl = (0.90 ns/pf) c l + 20 ns t plh , t phl = (0.36 ns/pf) c l + 22 ns t plh , t phl = (0.26 ns/pf) c l + 17 ns t plh , t phl 5.0 10 15 ? ? ? ? ? ? ? ? ? 65 40 30 125 75 55 ? ? ? ? ? ? ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 2. data labelled ?typ? is not to be used for design purposes but is intended as an indication of the ic?s potential performance. 3. the formulas given are for the typical characteristics only at 25 c. 4. to calculate total supply current at loads other than 50 pf: i t (c l ) = i t (50 pf) + (c l ? 50) vfk where: i t is in a (per package), c l in pf, v = (v dd ? v ss ) in volts, f in khz is input frequency, and k = 0.002.
mc14069ub http://onsemi.com 4 package dimensions soic?14 nb case 751a?03 issue k notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b does not include dambar protrusion. allowable protrusion shall be 0.13 total in excess of at maximum material condition. 4. dimensions d and e do not include mold protrusions. 5. maximum mold protrusion 0.15 per side. h 14 8 7 1 m 0.25 b m c h x 45 seating plane a1 a m s a m 0.25 b s c b 13x b a e d e detail a l a3 detail a dim min max min max inches millimeters d 8.55 8.75 0.337 0.344 e 3.80 4.00 0.150 0.157 a 1.35 1.75 0.054 0.068 b 0.35 0.49 0.014 0.019 l 0.40 1.25 0.016 0.049 e 1.27 bsc 0.050 bsc a3 0.19 0.25 0.008 0.010 a1 0.10 0.25 0.004 0.010 m 0 7 0 7 h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 6.50 14x 0.58 14x 1.18 1.27 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc14069ub http://onsemi.com 5 package dimensions tssop?14 case 948g issue b dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ?w?. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ?u? seating plane 0.10 (0.004) ?t? ??? ??? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ?v? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc14069ub http://onsemi.com 6 package dimensions soeiaj?14 case 965 issue b h e a 1 dim min max min max inches --- 2.05 --- 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.004 0.008 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 --- 1.42 --- 0.056 a 1 h e q 1 l e 10 0 10 l e q 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). 0.13 (0.005) m 0.10 (0.004) d z e 1 14 8 7 e a b view p c l detail p m a b c d e e l m z on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemni fy and hold scillc and its officers, em ployees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mc14069ub/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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